Micro packaging is the technology used for packaging electronic components that are microscopic in size such as integrated circuits, microchips and other miniature electronic devices. As the size of electronic components continues to shrink, advanced packaging technologies are required to keep up with the miniaturization of electronic devices. Micro packaging provides protection to these tiny components from environmental factors like moisture, dust, chemicals, vibration and mechanical stresses. It also enables connectivity between the microscopic silicon dies/chips and the outside world in consumer electronic devices.
Advancing Technologies in Micro Packaging
One of the emerging trends in Micro Packaging is 3D/TSV (Through Silicon Via) technology. 3D packaging stacks multiplethinned silicon dies on top of each other to form a single large package. This allows for higher component density and significantly miniaturizes the overall package size as components are placed horizontally and vertically. To interconnect layers in 3D packages, vertical vias are created through the silicon die using techniques like laser drilling or deep reactive ion etching. 3D/TSV packaging delivers performance and space advantages by shortening interconnect lengths and enabling higher bandwidth interconnections.
Another important area is wafer level packaging where the packaging process is done at wafer scale prior to dicing the wafer into individual chips. This results in cost reduction as packaging is done in parallel for all dies on the wafer. Fan-out wafer level packaging (FOWLP) is widely used which involves redistribution of I/O contacts away from the die edge to enable finer pitch connections. FOWLP provides heterogeneous integration capabilities by allowing different chip technologies to come together in a single package. Advancements in design and processing are making wafer level packaging techniques applicable for sophisticated logic and memory devices.
Packaging Materials and Miniaturization
The choice of materials for advanced packaging plays a key role in continued miniaturization of packages. Traditional organic laminate substrates are reaching their limits and being replaced by higher density interposers andsubstrates. Materials like silicon, glass, organic laminates and carrier wafers with embedded passives/integrated fan-out/fan-in configurations are becoming mainstream. Materials like organic laminates, mold compound and underfills are also evolving to adapt to new process technologies and form factors. Low-K and ultra low-K dielectric materials reducing parasitic capacitance effects are enabling higher speed designs. Thermally enhanced molding compounds are improving heat dissipation. Overall new materials allow for optimized electrical, physical and thermal properties essential for next generation packages.
At the packaging level, form factors are continuously shrinking with development of new standards. Packages below 1mm^2 are becoming commonplace driven by wearables and mobile applications. Packaging houses are deploying advanced automated, miniaturized packaging equipment compatible with these ultra-miniature formats. 3DMSL (3-Dimensional molded substrate laminate) is an emerging low cost solution for miniaturized multi-chip modules with thickness less than 1mm. miniaturized packages bring new assembly challenges involving tighter placement tolerances, smaller interconnections andthermal management in constrained footprints.
Improving Reliability of Micro Packages
Reliability remains a key concern as packages get smaller and transition to new manufacturing technologies. Advanced characterization and modelling techniques are used during development to predict long term reliability of cutting edge packages. Industry consortia are also defining standardized tests and procedures specific to new classes of miniaturized packages.
At the same time, package designs are integrating mechanisms to address potential failure issues. Underfills below the die and molding over the top enhance mechanical robustness. Low-k dielectrics help manage moisture penetration. Novel TSV designs address stress concerns from CTE (coefficient of thermal expansion) mismatches. Thermal vias and heat spreaders facilitate heat dissipation from ultra-thin modules prone to heating issues. Self-healing polymers and conductive adhesives increase reliability of fine-pitch interconnections. Overall a systems-level approach to reliability countermeasures ensures long usable lifetimes for microscopic packages.
Market Potential
The evolution of micro packaging technologies is transforming a range of mainstream and growth electronics market segments. Mobile devices are a major driver, with continuous innovation in areas of smartphones, tablets, wearables, hearing devices etc. Automotive and industrial sectors are also potential adopters with widespread integration of electronics and MEMS sensors/controls. Emerging applications of IoT, VR/AR, 5G communications and advanced servers mean packaging challenges will only intensify in coming years as performance requirements scale up. The global micro packaging industry estimated at USD 35 billion in 2023 is expected a robust 11% CAGR through 2028 as packaging scale and complexity increase with each new technology node. Continued investment in capital-intensive packaging R&D and manufacturing infrastructure will be needed to achieve the advancement and high-volume production capabilities required across industries. Micro packaging is truly at the heart of miniaturizing tomorrow’s cutting-edge technologies.
To summarize, micro packaging is a frontier technology domain enabling miniaturization of electronic systems. Advancements in 3D/wafer level integration, materials, form factors and reliability are driving rapid progress. With diverse applications across key growth sectors, micro packaging stands to play a transformative role in next generation products leveraging the IoT revolution. Sustained innovation across packaging technologies, equipment and materials is critical to meet the dimensional scaling challenges of evolving electronics roadmaps.
