Market Overview:
3D ICs, also known as three-dimensional integrated circuits, leverage the third dimension to stack silicon die and layers on top of one another. This allows for significant improvements in performance, power, and density over conventional 2D designs. In 3D ICs, multiple processing layers containing different electronic components like resistors, transistors are vertically stacked and connected using vias or interlayer connections. This enables the space inside the chips to be fully utilized. Common applications of 3D ICs include mobile devices, graphics cards, networking hardware, and servers where enhanced computation is required in limited spaces.
Market Dynamics:
The growth of the 3D ICs market is primarily driven by the miniaturization of electronic devices and need for compact chip packaging. As electronic devices become smaller and portable, there is a need to integrate more components in lesser space without compromising on performance. 3D ICs allow stacking of dies vertically thereby reducing the physical footprint. Secondly, 3D ICs provide significant improvements in bandwidth and speed by shortening electrical paths between stacked silicon layers as compared to conventional interconnect-limited 2D designs. The vertical connections enable data to transmit signals in the z-axis direction bypassing others. This makes 3D ICs well-suited for applications such as High-Performance Computing (HPC) where powerful processors and high bandwidth memory are needed.
The global 3d Ics Market Demand is estimated to be valued at US$ 16937.26 Mn in 2023 and is expected to exhibit a CAGR of 22% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.
Segment Analysis
The global 3D ICs market is dominated by the memory segment. This segment accounts for over 50% of the total market share owing to the growing demand for high bandwidth and power efficient memory chips across various industries like consumer electronics, automotive, etc. Memory segment is further divided into DRAM and SRAM. DRAM currently holds the largest market share under the memory segment due to widespread adoption in mobile and computing devices.
PEST Analysis
Political: The government agencies across regions are providing substantial funding for R&D activities related to 3D ICs. This is supporting the development of advanced 3D IC technologies.
Economic: The increasing spending on consumer electronics such as smartphones and tablets is driving the demand for more powerful and energy efficient 3D ICs.
Social: The growing proliferation of IoT devices and shift towards connected technologies is augmenting the need for compact and high-performance 3D ICs.
Technological: Advances in TSV and wafer bonding technologies have enabled the commercialization of 3D ICs. Further innovations are expected to enhance miniaturization, bandwidth and functionality of 3D chips.
Key Takeaways
The global 3D ICs market is expected to witness high growth, exhibiting CAGR of 22% over the forecast period, due to increasing adoption of 3D integrated circuits across various end-use industries.
The Asia Pacific region dominated the global market in 2020 and is expected to maintain its lead over the forecast period as well. China, Taiwan and South Korea are emerging as major hubs for 3D IC fabrication and are attracting significant investments by various players.
Key players operating in the 3D ICs market are Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation. Taiwan Semiconductor Manufacturing Company leads the market with over 35% share owing to its robust 3D IC technologies and mass production expertise.
*Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it
